ANG SEMI AS1509 3D Linear Digital Hall Chip

Enterprise News
Mar 22,2024


In the wave of innovation for foldable devices, precise angle detection is key to achieving a smooth user experience. Angsai Microelectronics has launched the AS1509 3D Hall sensor IC, which, with its unique 3D magnetic sensing technology, provides unparalleled angle perception capabilities for folding devices.


All-Direction Angle Perception: The AS1509 sensor IC, equipped with 3D magnetic sensing technology, can accurately capture every posture change of the device in space. Whether it's a flip phone, a folding tablet, or other innovative folding devices, the AS1509 provides precise three-dimensional angle detection, ensuring sensitive response and accurate positioning during the opening and closing process.

High Precision, High Reliability: The AS1509 has a high dynamic range of ±30mT and a high resolution of 2.5uT/LSB, ensuring precise and stable performance even in complex magnetic field environments. The built-in 16-bit ADC and I2C interface make data transmission fast and accurate, providing strong support for intelligent control of the device.

Intelligent Interaction, Convenient Experience: With the AS1509, foldable devices can achieve functions such as automatic screen wake-up, intelligent rotation, and multi-mode switching, greatly enhancing the user's interactive experience. The compact packaging and low power consumption design of this sensor IC make it an ideal choice for devices that pursue ultimate design.